Microsoft first disclosed today Hololens internal processor unit chip, optimized specifically for Hololens by TSMC, using 28-nanometer technology, with 24 DSP core, 65 million logic gates, 8MB of SRAM memory, and 1GB of low voltage DDR3 memory, the entire processing unit uses BGA package, an executable trillion operations per second.
This processing unit handles all of the sensor data, is also responsible for control of all output devices including the screen, including. Each function Hololens are processed by a dedicated hardware circuit, compared to the general-purpose processor programmed to solve, speed much faster.
Meanwhile Hololoens also a co-processor, use Intel Atom x86 Cherry TrailSingle-chip solution, the exclusive processor 1GB of RAM, running Windows 10 system, and is responsible for running a variety of App.
DSP unit power consumption 10W or less, use the hardware to run the algorithm efficiency is more than 200 times the software algorithms. DSP before the data is transmitted to the Atom processors are pretreated as possible, in order to ensure Hololens device can respond quickly.
Hololens development version to ship in April, priced at about $ 3,000. Is expected next year, listed Hololens dedicated Windows 10, when a Hololens portable 3D is a high-performance computer.
(Thematic map Source: theregister)