So, as another flagship product of the 10nm process, its muscles in the end hard, not hard?
Earlier, when I talked about Kirin 970, mentioned a point of view, it integrates 5 billion 500 million transistors is 1.77 times the number of Xiaolong 835, is A11 (4 billion 300 million) 1.28 times, representing HUAWEI's chip design ability, top.
But also attracted a lot of controversy, have questioned HUAWEI sacrifice chip area and crazy pile of transistors, "a mismatch".
As TechInsights updates its analysis of Apple's A11, and its chips are packaged as 89.23mm2, things are becoming clearer, so let's compare transistor densities.
Kirin 970's 100 square millimeter from the official press release of the Berlin conference, and 835 of Spec's data come from public data.
Kirin 970 of 55 million / mm2 is not only beyond the apple A11Two times more crushing Xiaolong 835.Although not directly and performance equate, but enough to prove HUAWEI Unicorn Team of TSMC 10nm technology super control and super chip design capabilities.
See here, only part of the experienceYu Chengdong said Kirin 970 is more complex than the Intel processor (of course, I still disagree).
Of course, there are two points to be emphasized in the end
The up arrow up apple A11
1, Xiaolong 835 and Kirin 970 are integrated baseband units in SoC, while Apple A11 is plug-in Qualcomm and Intel,So with this factor, Kirin 970 superb highlights again.
2, the transistor density algorithm in this paper is very rough, but in fact, more accurate should refer to the semiconductor master Intel formula, but the relevant data is lacking, it is impossible to get to the bottom of it.
Intel = = = reference formula