The bigLITTLE kernel design of ARM has a little understanding. In short, there are high performance core and low power core inside CPU. Different cores can be mobilized for different applications in order to achieve the balance between performance and power consumption. At present, Qualcomm 845 / 835, Huawei's Kirin 960R 970, and MediaTek's Helio series of processors all use bigLITTLE architecture, and are generally designed with four big cores and four small cores.
For Intel, their SoC processors also have to solve the problems between performance and power consumption. They also have high performance X86 cores, and a low power platform based Atom low power processor. It is also natural to do size core. Last month, there was a rumor that Intel would launch the Lakefield SoC processor, based on the 10nm process, the big core is a high-performance Ice Lake architecture (this is the new generation of desktop X86 cores), and the low power core is the new generation of Atom kernel - Tremont.
What about the performance of Lakefield? The Aeassa blog claims exclusive news that Lakefield's CPU performance will be stronger than high - pass processors - and that's no doubt that Intel has nothing to worry about if Intel can put the high performance X86 core in mobile SoC.
However, Lakefield's GPU performance may be a shortcoming. It uses the Intel Gen11 graphics architecture, better than the current Gen9/9.5, but high Qualcomm has been very strong in the mobile GPU field. No matter Samsung, Hester, or the Federation, there is no ground to shake high Qualcomm Andero GPU, either performance or energy efficiency. I can't do it.
The last is the release time of Lakefield, the original text was said to be the 2019 MWC exhibition, probably the way of 2 and March next year, but Intel's 10nm process production was postponed again, the official financial statement mentioned before 2019 will not be mass production, the front of Lakefield is really difficult.