According to foreign media reports, after demolition confirmed, Spectre Folio has adopted a very personalized long and narrow motherboard design, looks like a ruler from a distance. Originally, Intel worked with HP's engineering team.Using MCM (multi-chip-module) multi chip packaging technology to Amber Lake-YprocessorPCH (Nanqiao chip) and XMM 7560 LTE baseband chip are encapsulated on a single substrate, and finally achieve the feat of 12000 square millimeter motherboard.
Hewlett-Packard said the 3,000-square-millimeter area cut compared with the conventional scheme would make it possible to plug in larger batteries.
In fact, Intel's MCM solution was vividly demonstrated on the Kaby Lake-G processor earlier this year. Intel packaged the Kaby Lake processor, the AMD Vega GPU, and the 4GB HBM2 memory onto a single substrate.
And it's not hard to speculate that this integrated LTE baseband solution on Spectre Folio also seems to be a response to ARM notebooks. After all, one of the big selling points of the 835 Win10 notebooks that have already been shipped is small motherboards and large batteries, and support for Gigabit LTE networks.