It’s time to expose a new generation of iPhone parts, this time it’s still the motherboard.
The spy shot comes from the leaking god Slashleaks, which is said to be the motherboard used in one of the three new iPhones released this fall.
Due to the rectangular design, it is supposed to be used for the new iPhone 11R, because the iPhone XS and iPhone XS Max are now L-type motherboards. Of course, it is not excluded that the new iPhone 11 and iPhone 11 Max will also modify the motherboard design.
The production date of the motherboard in the spy shot is the beginning of March this year, the 10th week of 2019. The motherboard is printed on one side only, but the chip and circuit layout are quite different from the current iPhone XR motherboard.
The current news about the new iPhone XR is mainly the rear "Yuba" dual camera, 3D glass back shell, new green and purple color matching and 4GB storage. In addition, the battery life will be improved, and the battery capacity will increase by 6%. The new machine will also support "new" reverse wireless charging.