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Constant Scintillation Semiconductor and Research and Development of Ultra-Low Power Storage and Computation Integrated AI Chip by China University of Science and Technology

via:CnBeta     time:2019/7/19 12:38:46     readed:201

(Image source: Hefei Daily)

It is understood that the chip is an artificial intelligence chip with edge calculation and inference. It can detect and calculate the probability of face images taken by camera in real time. It is accurate and stable. It can be widely used in face recognition and rescue in forest fire prevention, real-time monitoring of ECG, and hard recognition of artificial intelligence in face recognition. Component solutions, etc.

According to the Hefei Daily, this marks the advent of an artificial intelligence chip with independent intellectual property rights in China, which is the first in China and the leading in the world.

Tao Linfeng, a member of the R&D team and doctor of China University of Science and Technology, introduced that the integration of storage and calculation is to combine storage and calculation. In the traditional computing process, the computing unit needs to extract the data from the storage unit and write back to the storage unit after the processing is completed. The integration of storage and calculation eliminates the data handling process and effectively improves the computing performance. Compared with traditional chips, memory-computing integrated AI chips have the characteristics of low energy consumption, high operation efficiency, fast speed and low cost.

According to the official website, Hefei Hengshuo Semiconductor Technology Co., Ltd. was registered in Hefei City in February 2015. It has a R&D center in Shanghai Pudong High-tech Park and a 3D NAND joint development laboratory and testing center in the Institute of Advanced Research of China University of Science and Technology. In addition, the company has established strategic partnerships with wafer manufacturers and packaging plants to jointly develop NAND, NOR flash, EEPROM and other new memory products.

Hefei Hengshuo Semiconductor Co., Ltd. is committed to the design, development, production and sale of advanced semiconductor flash memory chips and embedded flash memory. The core team members are from top memory companies. They have many years of experience in project management, design, manufacture and sales of flash memory chips. They also have successful entrepreneurial experience. The company has established strategic partnerships with wafer manufacturers and packaging plants to jointly develop NAND, NOR flash memory, EEPROM and other new memory products. At the same time, Hefei Hengshuo is cooperating with China University of Science and Technology to develop artificial intelligence (AI) chips based on NOR architecture. The company was registered in Luyang District of Hefei City in February 2015. It has a R&D center in Shanghai Pudong High-tech Park and a 3D NAND joint development laboratory and testing center in the Institute of Advanced Research of the University of Science and Technology.

Hengshuo Semiconductor Technical team uses fully independent and international advanced logic, layout design and testing patented / proprietary technologies to industrialize low-cost NOR flash (1Mb-256Mb and high-capacity high-speed NAND Flash series flash memory chips (8Gb-1Tb) in China. This series of NOR/NAND flash memory chips are all kinds of modern electronic products, such as:cellphoneInternet of Things (IOT), Computer, HD DigitaltelevisionKey chips of industrial control, wireless communication, office and medical equipment, on-board electronics, national defense security and cloud storage systems. It is also the core memory chip of all kinds of information security systems, such as mobile information terminal, USB Key system, encryption engine U disk, etc.

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