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Breaking Von Neumann Architecture and Restricting Domestic Research and Development of Integrative Memory-Computing AI Chips

via:博客园     time:2019/7/19 13:05:32     readed:137

Author: Xianrui

Everyone knows our current computer.

Hefei Daily reported that on July 16,The demonstration of Computing In Memory AI chip system developed by Hefei Hengshuo Semiconductor Technology Co. Ltd. and China Science and Technology University team for two years has been successfully completed.This is the case.

This marks the advent of an artificial intelligence chip with our own intellectual property rights, which is the first in China and the leading in the world.

Tao Linfeng, a member of the R&D team and doctor of China University of Science and Technology, introduced that the integration of storage and calculation is to combine storage and calculation. In the traditional computing process, the computing unit needs to extract the data from the storage unit and write back to the storage unit after the processing is completed. The integration of storage and calculation eliminates the data handling process.Effectively improve the computing performance. Compared with traditional chips, memory-computing integrated AI chips have the characteristics of low energy consumption, high operation efficiency, fast speed and low cost.

It is understood that the chip is an artificial intelligence (AI) chip with edge calculation and reasoning. It can detect and calculate the face images taken by the camera in real time, and it is accurate and stable. It can be widely used in face recognition and rescue in forest fire prevention, real-time monitoring of ECG and artificial intelligence in face recognition. Hardware solutions.

According to the official website, Hefei Hengshuo Semiconductor Technology Co., Ltd. was registered in Hefei City in February 2015. It has a R&D center in Shanghai Pudong High-tech Park and a 3D NAND joint development laboratory and testing center in the Institute of Advanced Research of China University of Science and Technology. In addition, the company has established strategic partnerships with wafer manufacturers and packaging plants to jointly develop NAND, NOR flash, EEPROM and other new memory products.

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