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The core wafer manufacturing is mainly in the United States, Ireland and Israel. The packaging and testing plants are mainly in Asia, including Chengdu, China, Ho Chi Minh, Vietnam and Penang, Malaysia. There are also packaging plants in Costa Rica and Dalian, China, but the former has been closed. The latter has turned to 3D NAND flash production.
Intel's packaging plant for the 300 series chipset is mainly related to Q370, C246, HM370, QM370, CM246 and H310. The transfer test and test factory has no change in performance and specifications. The main influence is the origin information on the label. It used to be “Made in China” and later “Made in Vietnam”.