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Disassembly report: Huawei freebuses 3 real wireless headset

via:CnBeta     time:2019/12/2 1:10:32     readed:911

Huawei freebus 3 true wireless headset is the first terminal device equipped with Kirin A1 chip developed by Huawei. It is also the first active noise reduction headset with semi in ear design in the world. It supports dual channel synchronous transmission technology and Bluetooth 5.1. The charging box supports wireless charging. Some earplugs are round. The weight of a single earphone is only 4.5g. It is light and transparent to wear. With the dismantling of my love audio network, I have a look at the internal design, internal workmanship and internal components of freebuds3, and explore the secret of semi open active noise reduction.

On the front and top of the package are printed: Huawei freebuses 3 wireless headset, Kirin A1 chip, smart noise reduction, wireless fast charging. In the upper right corner is Huawei's petal logo. The product renderings occupy the middle part. The left and right earphones are in suspension state, creating the feeling that the earphones are as light as feathers.

On the back of the package, the previous layout style of freebuses 2 Pro is continued. The top part is the product feature icon, the middle part is the product specification, the bottom part is the precautions for headphones, Huawei address and contact information.

Package list: headset, user guide, safety information, charging line, warranty card.

A usb-a to USB type-C charging cable is included in the package.

Close up of the front of the charging box. Freebuds3 supports free personalized radium carving service. The words "I love audio network" in the middle of the box indicate that this is the freebuds3 exclusive to my love audio network.

Close up of the back of the charging box. The middle part is a square mirror area. In the middle of the area is the word Huawei. The exposed part of the hinge is in the square area, delicate and ingenious.

Pairing key located on the side of the charging box.

The USB type-C charging interface at the bottom of the charging box is next to the charging indicator light of the charging box.

Close up of headset charging indicator inside the charging box.

The positive charging contact of the headset.

Close up of the negative charging shrapnel at the bottom of the earphone socket of the charging box.

Close up of headset charging box opening.

My love audio network uses chargerlab power-z kt001 to conduct wired charging test on Huawei Huawei freebuses 3 wireless headset, with charging voltage of 5.201v and charging current of 1.267a.

My love audio network uses chargerlab power-z kt001 to conduct wireless charging test on Huawei Huawei freebuses 3 wireless headset, with charging voltage of 5.153v and charging current of 0.577a.

The weight of headphones on the left and right side of the charging box: 57.6 g.

Charging box weight: 48.4g.

Weight of left and right earphones: 9.2g.

II. Huawei freebus 3 real wireless headset disassembly

Let's first pry open the lower shell of the charging box.

Close up of the USB type-C charging interface metal fastener inside the lower shell of the charging box, next to which is the LED light shield.

Close up of the back of the key structure inside the lower shell of the charging box. This is the contact piece of the microswitch. Both sides are also fixed by the yellow green glue.

Close up on the front of the key structure inside the lower shell of the charging box, which is the key cap for inching open.

Close up of microswitch with key structure.

One side of the middle structure inside the charging box is provided with a wireless charging coil.

On the other side of the middle structure inside the charging box, the battery on this side is sealed by a transparent rubber shell, which is fixed to the shell with screws.

Close up of the microswitch inside the charging box contacting the shrapnel.

There is a circle of rubber around the USB type-C charging base to improve the tightness.

We separate the wireless charging coil inside the charging box from the middle structure.

Close up of the main board inside the charging box. Both the main board and the auxiliary board are connected by a flat wire. The black rectangular flat wire on the right is the flat wire of the charging interface, the white flat wire on the left is the flat wire of the charging thimble, and the two-dimensional code flat wire is the flat wire of the battery.

Local close-up of the internal part of the charging box, earphone positioning magnet and charging box closing magnet can be seen locally.

Close up of headset charging thimble.

Close up of charge thimble / LED indicator / Hall element FPC front.

Close up on the back of FPC of charge thimble / LED indicator / Hall element.

Close up of headset led charging indicator / Hall element panel.

Close up of the cable outlet on the main board.

The inside of the charging box is disassembled.

Close up of the charging metal shrapnel of the earphone socket. The black rubber on the side is the inner sleeve at the bottom on the inside of the plastic base.

Close up of charging box led charging indicator.

Close up of the front of the USB type-C motherboard of the charging box.

Close up of the back of the USB type-C motherboard of the charging box.

The lithium battery is fixed in the rubber shell and has a black sponge as buffer.

Close up of lithium polymer battery, model: hb681636ecw, 410mah / 1.56wh/3.82v, made in China, production date: August 19, 2019.

Close up of battery protection circuit, IC on the surface is covered with hard glue.

Close up of front of charging box main board and wireless charging coil.

Close up of the back of the charging box main board and wireless charging coil.

Silk screen 94en 76 IC.

Silk screen La IC.

Screen printing 124 IC.

Silk screen JA3.

Screen printing hccq k3j IC.

Silk screen 71t IC.

Silk screen 941 qxa a3v4 IC.

Screen printing 737 IC.

Silk screen 9106b AAS1 IC.

Ti Dezhou instrument bq25601 battery charging management and system power path management IC.

Details of bq25601.

IDT p9221 wireless charging IC.

P9221 details.

Screen printing f411ce6 008 VQ a Tw9 10 IC.

Let's take a look at the headphones section.

Close up of the negative charging contact at the bottom of the headset and the microphone opening of the call. The microphone opening is side exposed. It is integrated with the charging contact to reduce the sense of splitting and improve the appearance integrity.

Close up of noise reduction microphone opening on headset handle.

Close up of the positive charging contact on the inside of the headset.

Close up of headphone inverter hole.

Close up of the window opening and sound outlet of the optical sensor inside the earphone.

Close up of the outlet on the other side of the headset.

We remove the headphones from the head.

A black insulating plastic sheet can be seen inside the earphone cavity.

Uncover the black insulating plastic sheet to expose the sensor sub plate at the bottom.

The earphone has an independent inverted phase tube design to increase the bass effect of the earphone.

Close up of the positioning magnet inside the headset.

Close up of inner wall positive charging contact.

The auxiliary plate of bone conduction microphone is fixed by white silica gel, and components can be seen below.

Remove the white silica gel and expose the black plastic insulation cover plate.

Remove the cover plate, and there is a set of auxiliary plate components below.

Close up of the outside of the earphone phase guide.

The opening of the inverted phase pipe to the outside.

Close up of the inside of the headphone inverter.

Close up of the invert hole inside the headset, covered with a screen.

Because the internal components of the earphone handle are fixed too tightly, they can only be disassembled violently.

This part is the Bluetooth antenna on the top of the headset handle.

Close up of the silicon microphone on the bottom of the headset.

Close up of Bluetooth antenna on top of headset handle.

The side saddle structure is responsible for orderly stacking the FPC inside the headset.

Solder joint of earphone unit shall be reinforced with red glue.

Remove the solder joint with a soldering iron, separate the main board which is adhered to the back of the unit with double-sided adhesive, and then take out the unit.

Close up of the back of the speaker unit.

Close up of the front of the speaker unit.

The size of speaker moving coil unit is 14mm.

Black plastic cover plate is embedded in the head cavity.

Remove the black plastic cover, the sensor window on the inner wall of the headset and the close-up of the sound outlet.

Front view of internal overall structure.

Inside overall structure at the back.

Laser g314 9010 call Si Mai close-up.

The comparison between the linear lithium polymer battery and the one yuan coin.

Close up of the front of the lithium polymer battery.

Close up of the back of the bar type lithium polymer battery, battery specification: 3.82v, 0.11wh.

Close up of noise reduction silicon microphone sound hole.

Laser g303 9315 noise reduction silicon microphone close-up.

Close up of front side of auxiliary board.

Close up of the back of the secondary panel.

Silk screen 71t IC.

Silk screen mu5 J2K IC.

Silk screen 789 947 IC.

Close up of headset Bluetooth antenna shrapnel.

Close up of the front of the sensor sub board.

Close up of the back of the sensor sub board.

Close up of the positive charging contact of the headset.

The bone conduction microphone (vpu14aa01) from Danish sonyon is mainly responsible for picking up the voice signal of the wearer by using the bone conduction principle, bringing excellent signal-to-noise ratio of speech to environment noise. It is a sensor with small package (3.5 * 2.65 * 1.5mm), wide language band up to 10kHz, very low power consumption, low power consumption and high sensitivity.

Close up of the front of the motherboard.

Close up of the back of the motherboard.

Motherboard compared with one dollar coin.

Screen printed q64fwy ig1926 IC.

Screen printed pq9 21 IC.

ADI adenau1787 has 4adc, 2dac low power codec of audio DSP.

Adau1787 details.

Silk screen 356h 1910 j7r IC.

Silk screen hi 1132 main control chip, which should be Huawei's Kirin A1 chip.

Headset touch FPC close up.

Close up of the inner wall of the black structure of the headphone head cavity, including the optical distance sensor and the golden bone voiceprint sensor antenna.

Huawei's freebuses 3 real wireless headset is disassembled.

I love audio network Summary:

Huawei's freebus 3 true wireless headset charging box is designed with a round cake, in which square sequins are embedded in the center of the shell, making it feel round and delicate, and the shape is unique and simple. The earphone is ergonomically designed with a light body, which is not easy to slide down in action, and it is still comfortable to wear for a long time.

The internal design of the headset is highly integrated and complex, the components are highly customized, and the packaging process is highly airtight. It can be said that disassembling the headset end is peeling and cocooning, which shows Huawei's great efforts in internal design. The built-in bone voice sensor can effectively reduce the environmental noise and improve the call quality. The small earphone is equipped with a 14mm large dynamic unit and a built-in phase inversion tube to create a shocking bass effect. The built-in Kirin A1 chip supports Bluetooth 5.1, dual channel synchronous transmission, and built-in high-speed audio processing unit, so that freebus 3 can realize low delay, stable and fast wireless connection.

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