Recently, the semiconductor market has been in turmoil. Huawei is banned in the United States, the global epidemic has led to economic downturn and other factors affecting the development prospects of semiconductors,There was a rumor that TSMC had delayed the advanced manufacturing process. Among them, 3nm was delayed for half a year until the trial production in Q1 next year, but the official denied the news.
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The TSMC 3 nm is the next-generation node after 5 nm, and official information shows that the 3 nm process transistor density has reached the unprecedented 250 million/ mm², and the 5 processes are only 180 million/ mm.TwoThe performance of 3nm is 7% higher than that of 5nm, and the energy consumption ratio is 15%.
In terms of process, TSMC thinks that the current FinFET process is better in cost and energy efficiency after evaluating various options, so the first 3 nm will still be FinFET transistor technology.
However, TSMC denied the rumors today, saying that everything was carried out according to the plan. The 3nm process was put into trial production in Q1 quarter of 2021 as scheduled, and the formal mass production was carried out in the second half of 2022.