TSMC has made significant research breakthroughs in the field of 2 nm semiconductor manufacturing nodes,It is expected to enter the trial production stage of 2nm process in the middle of 2023 and start mass production one year later.
At present, the latest manufacturing process of TSMC is 5nm process, which has been used to produce A14 bionic chip.
According to the introduction, TSMC's 2nm process will adopt a differential transistor design. This design, known as the multi bridge channel field effect (mbcfet) transistor, complements the previous FinFET design.
It should be noted that this is also the first time TSMC has designed mbcfet for its transistors.
At the same time, he said, mass production will begin in 2024.
TSMC set up a 2nm project R & D team last year to find a feasible development path. Considering the cost, equipment compatibility, technology maturity and performance, mbcfet based on GAA process is adopted in 2nm. The structure solves the physical limitation of current controlled leakage caused by FinFET process shrinkage.