(This article is authorized to reprint by Chaoneng. Other media reprint should be approved by Chaoneng.）With the continuous production of 7Nm and 5nm processes in recent years, TSMC has brought considerable income from the new process technology. Of course, they have also invested a lot of energy and capital to develop new processes to maintain the leading edge. Two days ago, TSMC held a completion ceremony for the new plant of Tainan Science Industrial Park, which is their future 3nm factory. It is expected that TSMC will have a 3nm project in the second half of 2022 Art will be put into production.
Of course, with the gradual development of semiconductor technology, it is gradually difficult to upgrade the process. The investment required is also increasing, and the newspaper group cooperation is more and more. TSMC has brought Google and AMD to cooperate.
TSMC is cooperating with Google to promote the production of 3D chip process, and AMD is also involved in it. It is said that it is to overcome some difficulties in silicon manufacturing. It is certain that Google and AMD will become the first users of TSMC's advanced 3D chip process. They are preparing design for the new process and helping TSMC test and certify the process.
This 3D chip technology should refer to the wafer on wafer (wow) 3D chip packaging process of TSMC. They are developing it in chip packaging plants in Miaoshi,Unlike TSMC's cowos 2.5D packaging method, TSV silicon perforation technology is used to realize real 3D packaging. Similar to Intel's forros 3D package, it can stack multiple chips layer by layer like building a house, and even seal chips with different processes, structures and uses.
Google estimates that it plans to use TSMC's 3D packaging technology to make a new generation of TPU AI chips. Amd may use more of them. CPU, GPU and various SOC can be used. Apple is not on this list, but it is not known whether it will be the first batch of users.
In addition, techpowerup says that Fabs are preparing to raise their 8-inch wafer offers from 2021. Several fabs, including United Microelectronics, global foundries and vanguard international semiconductor (VIS), have raised their 8-inch wafer prices by 10-15% in the fourth quarter of 2020 and 20-40% in 2021. Wafer foundry often does not adopt unified pricing, but relies on the specific order size and design requirements to quote.
Wafer foundry industry mainly focuses on wafer manufacturing nodes and wafer size. Telescope magazine has written an article to analyze typical use cases of each wafer size.Although strictly related to the pricing of 8-inch (200 mm) wafers, the upcoming price rise in the semiconductor industry as a whole can be inferred from a substantial increase in labor costs. For example, TSMC plans to have a 20% salary increase for its employees in 2021.
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