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99% solid weight: the first dual core packaging of AMD mi200 computing card

via:驱动之家     time:2021/3/7 19:11:03     readed:155

The message of AMD mi200 computing card has appeared many times, and the latest evidence shows that,It will almost certainly use MCM multi-core package design

AldebaranIt's not Intel alder Lake's 12th generation core processor.

The patch didn't provide much information, but it came out of nowherealde_ die_ 0、alde_ die_1It's obvious that the internal dual core design is very stable.


Competitors will be Intel Xe HPC and NVIDIA hopper.

in fact,Amd has applied for the patent of GPU small chip integrated packaging for a long timeTo prepare for this, and according to the rumor,The next generation of consumer game cards based on rDNA 3 architecture also have a great probability of dual core packagingSo as to build a nuclear reactor.




It's just a nuclear reactor. It's a small idea!


Reprint please indicate the source: fast technology

AMDGraphics cardCalculation card

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