Not long ago, it was reported that Huawei's self-developed OLED screen driver IC chip has completed trial production and is expected to officially deliver it to the supplier by the end of this year.
Since Huawei does not have a wafer factory, the chip still needs outsourcing.
According to the latest report, as the planned monthly production capacity is only a few hundred wafers, several wafer factories in Taiwan seem to be less interested, and the hope of establishing order cooperation is slim.
it is reportedThe OLED driver IC adopts 40 / 28nm process, and will be manufactured by SMIC in the end.Although some people in the industry worry that the low profit of DDI chips may affect the gross profit margin of SMIC China.
When talking about the cooperation with Huawei Hisilicon earlier, Zhao Haijun, CO CEO of SMIC, once determined that there was still a way to go in compliance, and all things could stand the investigation and test.
In addition to mass production, there is also a problem that high-end packaging and testing services are not easy to contactChibong technology and Nanmao technology are monopolists of DDI chip packaging and testing in non Korean enterprises, but their lists of Lianyong are not enough, and the expansion of production needs greater capital support.
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